Electronic assembly is becoming more and more dense. How can UV three anti-glue meet the requirements of precision dispensing?
Publish Time: 2025-04-05
At the moment when the electronics industry is developing rapidly, electronic assembly is moving towards high density and miniaturization. The chip size is shrinking, and the components on the circuit board are arranged more and more closely, which poses unprecedented challenges to the dispensing process in the electronic assembly process. As an important protective material, UV three anti-glue plays a key role in meeting the requirements of precision dispensing with its unique performance advantages.Precise curing characteristics ensure dispensing accuracyUV three anti-glue achieves rapid curing through ultraviolet irradiation, which gives it a significant advantage in precision dispensing. During the dispensing process, precise control of the time and intensity of ultraviolet irradiation can ensure that the glue is instantly cured at the desired position and avoid position deviation caused by the flow of glue. For example, when encapsulating microelectronic chips, a UVLED curing machine equipped with a high-precision spot positioning system can be used to accurately focus ultraviolet rays on a tiny dispensing area, so that the glue can be cured in a very short time, meeting the chip encapsulation requirements for dispensing accuracy up to micron level.Low viscosity properties adapt to fine coatingAs the size of electronic components decreases, the amount of glue required for dispensing is also greatly reduced. UV three anti-glue usually has a low viscosity, which can achieve precise coating of extremely small amounts of glue through precision dispensing equipment. The viscosity of some advanced UV three anti-glue products can be adjusted according to actual needs, while ensuring the fluidity of the glue, avoiding problems such as drawing and dripping. In the assembly of smartphone camera modules, the use of low-viscosity UV three anti-glue for dispensing can evenly apply the glue between the tiny lens and the sensor to ensure the optical performance and stability of the module.Excellent electrical performance ensures electronic safetyIn electronic assembly, dispensing materials need to have not only good mechanical properties, but also excellent electrical properties. After curing, UV three anti-glue has high insulation resistance and low dielectric constant, which can effectively prevent short circuits and leakage between electronic components. In the protection of PCB boards, UV three anti-glue is used for comprehensive coating, which can form a uniform insulating protective film on the surface of the circuit board, preventing the intrusion of harmful substances such as moisture and dust, while ensuring that the signal transmission on the circuit board is not disturbed, meeting the high requirements of electronic products for electrical safety.Environmental protection characteristics meet the needs of green productionWith the continuous improvement of environmental awareness, the environmental protection requirements of the electronics industry in the production process are becoming increasingly stringent. UV three anti-glue adopts a solvent-free formula and does not produce volatile organic compounds (VOCs) during the curing process, which is environmentally friendly. Compared with traditional solvent-based three-proof glue, the use of UV three anti-glue reduces the emission of harmful substances and reduces the health hazards to operators, which is in line with the development trend of green production. In the production process of electronic products, the use of UV three anti-glue for dispensing and protection helps enterprises achieve sustainable development goals.Construction flexibility meets diverse needsThe construction methods of UV three anti-glue are flexible and diverse, and can be applied by brushing, spraying, dipping and other methods. Different construction methods can be selected according to the structure and assembly requirements of electronic products to meet diverse production needs. For example, for electronic devices with complex shapes and compact structures, selective spraying can be used to precisely spray UV three anti-glue on the parts that need protection; for large-area circuit boards, dip coating can be used to achieve fast and uniform coating.In the context of increasingly intensive electronic assembly, UV three anti-glue can well meet the requirements of precision dispensing with its advantages such as precise curing, low viscosity, excellent electrical properties, environmental protection characteristics and construction flexibility.
